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- OnePlus now requires an application to unlock the bootloader in China
OnePlus now requires an application to unlock the bootloader in China
Samsung’s metalens tech could reduce camera bump and wobble
GIZMOCHINA DAILY
Daily Tech News & Insights, Every Weekday.
Good morning, tech folks! ☀️ I hope you all had a good weekend.
Starting off this week, we've got Samsung partnering with POSTECH to develop revolutionary metalens technology that could eliminate camera bumps and phone wobble, Xiaomi reportedly planning their second-generation Xring O2 chip launch for Q2 2026 with latest Arm architecture, and OnePlus tightening bootloader access in China.
Meanwhile, Huawei's finally revealing their Pura 80 series processor details after years of secrecy, while Red Magic's Shadow Blade 3 gamepad goes global to transform smartphones into portable consoles.
Here's what you'll discover in today's tech roundup:
Samsung's metalens breakthrough collaboration with POSTECH using nanostructures to eliminate camera bumps and reduce device thickness
Xiaomi Xring O2 chip's Q2 2026 launch timeline featuring latest Arm architecture for second-generation in-house processor
OnePlus's new bootloader restriction policy in China requiring official applications through ColorOS 16 for security reasons
Huawei Pura 80 series update finally revealing processor specifications after years of chipset secrecy
Red Magic Shadow Blade 3 gamepad's global launch transforming smartphones into handheld gaming consoles
Additional insights on China's smart glasses market doubling, AI legal case solutions, and Xiaomi's MIJIA Air Purifier 6 global debut
Read on for all the details!

Samsung is working on a new kind of lens that could make future smartphones or XR headsets slimmer without cutting corners on performance. The company has teamed up with Pohang University of Science and Technology (POSTECH) to develop its latest “metalens” technology, described in a paper published in Nature Communications.
Instead of using traditional curved glass, a metalens controls light using nanostructures that are thinner than a human hair.
Read on to find out more.
![]() Xiaomi is reportedly preparing to launch its second-generation self-developed SoC, the Xring O2, between the second and third quarters of 2026. According to tipster Fixed Focus Digital, the chip could debut around September next year. It will follow the company’s first in-house processor, the Xring O1, which marked Xiaomi’s entry into independent chip design. | ![]() OnePlus is tightening the rules around bootloader access with its latest software update. With the rollout of ColorOS 16 in China, users who want to unlock their phone’s bootloader will now need to apply through official channels instead of simply toggling a setting in developer options. In a post this week, the company said the change is meant to “ensure device and data security and enhance system stability.” |
![]() Huawei recently rolled out a new HarmonyOS NEXT update for the Pura 80 series in China, and it’s a hefty one at 1.52GB. The version 5.1.0.217 SP2 update brings the usual system optimizations along with a handful of tweaks to the Calendar and Memo apps. But what makes this update stand out is a small yet significant change. For the first time in years, Huawei is openly listing the processor inside its flagship phones. | ![]() Back in June 2025, the Red Magic Gaming Tablet 3 Pro made its official debut in China along with the global announcement of the Red Magic Astra. But apart from the two gaming tablets, the brand also unveiled the Shadow Blade 3, which is a gamepad that turns your smartphone into a handheld console. It was initially available in China, and now, the wireless controller is available in the global market as well. |
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Joel Joseph
Editor-in-Chief @ Gizmochina.com